Continuous Improvement Program

A continuous improvement program (CIP) leverages unpatterned wafer defect inspection to identify the specific process tools causing defects. With a tool monitoring CIP in place, automotive fabs can set objective targets for reducing the process defects that affect reliability.

Surfscan^®系列

Drive to Zero Defect

With Zero Defect Screening, fabs monitor 100% of die on all wafers at the critical process steps. This requires an inspector that is fast, sensitive and can reliably identify which defects matter. With this method, die that may fail are removed from the supply chain at the fab, where cost is lowest. A high sensitivity inspection strategy can partner with screening techniques to enable discovery of yield-critical defects for faster characterization of new processes and additional defect reduction.

8 Series

C205

Puma^™

Certified & Remanufactured

I-PAT^®

Advanced Design Node Inflection

Automotive features such as machine vision and AI require advanced ICs. To attain higher yield and quality standards for advanced design node devices, fabs require discovery of all systematic defect sources and an “every defect matters” approach to improving baseline yield.

39xx Series and 29xx Series

Voyager^®系列

ESL10™

eDR7xxx™ Series

Enhanced IC Packaging and PCBs

当今的高级包装技术依赖于创新的过程技术，以提供改进的IC组件性能和多功能集成。为了防止有缺陷的设备在供应链中向前移动，筛选和排序是包装IC组件，IC基板和印刷电路板（PCB）的重要质量控制步骤。检查和计量系统捕获了关键缺陷和变化，以持续改进包装和PCB过程，与可靠性相关的问题以及设备故障可追溯性。

Packaging Manufacturing

Orbotech PCB Inspection

电源设备的可靠性

Implemented in a wide range of automotive subsystems, power devices require the same quality standards as other automotive ICs. Specialized equipment for SiC epitaxy and GaN-on-silicon processes, and inspection systems for SiC substrates help manufacturers of power devices achieve automotive defect standards.

SPTSPower Device Manufacturing

Power Device Process Control

Certified & Remanufactured