The Alpha-Step^®100 is the first product of Tencor Instruments.

The Alpha-Step provides impressive improvements in step height measurement accuracy and repeatability over the existing competitive products. With its attractive pricing, small form factor, and improved functionality, it is soon considered acritical quality control toolin most semiconductor fabrication plants, or fabs.

Alpha-step 200工具与比比赛快2倍, a CRT monitor to display the scan profile, plus computer-controlled automated measurement, leveling and calculations.

新的alpha-step 250具有enhanced sensitivity down to 1 Å，使用声学围栏将测量结果与环境隔离开来。

Tencor P-1长扫描手写笔剖面图是该行业中第一个在单个配置文件中提供Ultra-Flat 200mm扫描的产品，而无需缝制。

The release of the P-1 Long Scan profiler features a revolutionary new design, with industry-first innovations to the scanning stage, optics, and sensor technology-—innovations that provide rock-solid stability, unbeatable sensitivity and repeatability。该系统具有一个超级灯泡扫描阶段，能够在单扫描中进行高分辨率扫描高达200mm，从而可以表征表面粗糙度，波浪性和薄膜应力。新阶段也是该行业的第一个3D扫描阶段，增加了表面地形的第三维度。该系统具有第一个顶级视图，可清楚地看到样品，从传统的角度侧视图中没有失真。最后，传感器技术结合了该行业的第一个也是唯一的线性变量差异电容器（LVDC），从而产生了惯性较低的次数电子分辨率，从而实现了低力控制并降低对噪声的敏感性。

Tencor P2H是该行业的第一个支持automated wafer and disk handler为了最大程度地减少触摸样品的操作员引入的缺陷。

The Tencor P2 open frame offers users the flexibility to load样品最多430mm x 430mmwhile the Tencor FP2 provides support for the flat panel industry by enabling scans of samples up to 630mm by 630mm.

Tencor P-20是该行业的first fully automated stylus profiler从将晶圆盒放在工具上到最终测量结果。为了实现完整的自动化，P-20与现有处理程序相结合添加了模式识别和SEC/GEM。

Alpha-step 500通过添加了高度高达1mm的功能，以及新的高放大光学元件和彩色摄像头的功能，建立在先前产品的成功基础上。

The release of the Tencor P-10, P-11, P-12, and P-22 feature the latest innovations in low force control, the capability for steps up to 1000µm, and enhanced environmental isolation.

The Microhead II enhances the linear variable differential capacitor (LVDC) with the addition of recipe-controlled low force, down to 0.05mg. It addsconstant force control通过动态调节枢轴上的力，以便在样品表面上施加相同的力，而不管阶跃高度如何。此外，还可以使用新的传感器来支持高达1000µm的台阶高度。P-12增加了新的声学隔离皮肤和一个主动隔离表，从而增强了环境噪声的隔离，从而可以测量超平滑的硬盘驱动盘的粗糙度。P-22为现有的基于P-20处理程序的系统添加了一个隔离表，用于全自动测量，包括晶圆处理能力，模式识别和SECS/GEM，从而通过对半导体行业的总解决方案提高了生产效率。

The Tencor P-30 replaces the open cassette handler with a SMIF handler and a mini-environment inside the system to support new low particle requirements of the semiconductor industry.

Tencor Instruments and KLA Instruments merge to become KLA-Tencor, Inc., theworld leaderin yield management and process control solutions for semiconductor manufacturing and related industries.

的合^®-220 is a breakthrough for inline surface metrology with anindustry-first patented dual-stage stylus profiler, combining the long scan stage of the P-22 with a high-resolution piezo stage and the DuraSharp^®stylus to enable fine-feature measurement and analysis.

的合-320 extends the capability of the HRP-220 to 300mm wafers, with the industry’s first and only system capable of measuring the单个扫描中的300mm晶片的全直径。This tool also offers a dual stage and the first fully automated measurements using a 200mm/300 mm handler system.

的合-240 and HRP-340 represent significant enhancements to the HRP product lines by improving the ease of use, throughput, and precision.

A new piezo flexure stage design is added to minimize out-of-plane motion,improving scan flatness by >2x在先前的设计上，以1NM分辨率维持90µm x 90µm扫描区域。该系统添加了内联和低放大光学的光学元件，并利用接近传感器启用无接触式对焦，从而可以快速，精确的焦点以及通过减少表面上的手写笔触摸的数量来改善手写笔寿命。通过添加线性编码器，可以改善长扫描阶段，从而更准确，并使用更精细的螺距铅螺丝螺纹分辨率。通过添加数字信号处理器来处理所有阶段控件，从而为用户界面保留计算机处理能力，从而提高了整体系统性能。最后，浸入模式^™enables measurement of high aspect ratio etch depth features.

Tencor P-15结合了P-10和P-11系统，以提供complete surface topography measurement systemto support both R&D and production environments on a single platform.

Ambios Technology releases the XP1 and XP2 stylus profilers that feature the industry’s first and only systems with optical lever sensor technology.

The XP1 and XP2 stylus profilers from Ambios Technology introduce an optical lever sensor technology adapted from the Atomic Force Microscope (AFM). Theoptical lever sensor enables faster scanningwhile maintaining accurate surface profiling. The novel sensor combined with low force control and support for samples up to 200mm provides customers an affordable surface topography measurement solution.

The Alpha-Step IQ takes the proven performance of the Alpha-Step 500 and adds new USB electronics and completely redesigned software to significantlyimprove the ease-of-use并提供增强的扫描测序和数据分析能力。

The Tencor P-16+ offersimprovements to the industry-leading P-15: new USB electronics, enhanced software, plus Apex advanced data analysis and report writing software.

The Tencor P-6 features the P-16+ LVDC sensor technology and scanning stage technology in a smaller platform, resulting in a high-performance stylus profiler that提供了良好的价值。

的合-250 and HRP-350 tools launch with a lower noise LVDC sensor technology, a new isolation system (HRP-350 only) and a redesigned DuraSharp II stylus. These innovations enable measurement of smaller features andnearly 2x the throughput。

Ambios Technology joins KLA and releases the XP100 and XP200, enhancing the performance of the previous platforms with a new sensor that measures features up to 1200µm tall.

KLA-Tencor releases the Alpha-Step D-100 and D-120 based on the Ambios Technology platform, featuring增强的光杆传感器技术with significant improvement in measurement stability.

新的Tencor P-7和P-17产品功能industry-leading measurement precision,最高resolution color camera available on a stylus platform, and new performance specifications for long-scan capability critical for bow and stress measurements.

The Alpha-Step D-500 and D-600 tools release with the same high-resolution camera as the P-7 and P-17 platforms. They are the only stylus profilers to feature keystone correction, toremove distortion from the side-view optics，并且它们提供了光杆，扫描阶段和隔离热源的改进，从而可以更好地测量可重复性。

Tencor P-170结合了P-17的性能与HRP处理程序的生产良好性能，从而为复合半导体市场提供了完全自动化的测量能力。

The P-170 and HRP-260 tools launch with enhanced,production-proven measurement stabilityand tool matching. The new platforms feature significant improvements in pattern recognition with the addition of geometric pattern recognition, improved accuracy in the deskew algorithm, and new methods for automatic light control. The handler includes new electronics and support for transparent samples such as silicon carbide (SiC) and sapphire, and for opaque samples such as silicon, gallium arsenide (GaAs) and AlTiC. These innovations enable industry-leading, fully automated surface topography measurements with advanced pattern recognition, matching, automated data analysis capability and support for the latest SECS/GEM automation standards.