产品描述
The Tencor P-170 is a cassette-to-cassette profiler featuring the P-17’s industry leading benchtop system measurement performance and the HRP®-260’s production proven handler. This combination provides a low cost of ownership solution for a handler-based system serving the semiconductor, compound semiconductor and related industries. The Tencor P-170 supports 2D and 3D measurements of step height, roughness, bow, and stress for scans up to 200mm without stitching.
Excellent measurement stability is achieved with the combination of the UltraLite®sensor, constant force control and an ultra-flat scanning stage. Recipe setup is fast and easy with point-and-click stage controls, top and side view optics and a high-resolution camera with optical zoom. The Tencor P-170 supports 2D and 3D measurements, with a variety of filtering, leveling, and data analysis algorithms available to quantify the surface topography. Fully automated measurements are achieved with automated wafer handling, pattern recognition, sequencing and feature detection.
Features
- Step height: Nanometers to 1000µm
- 恒定力控制的低力：0.03至50mg
- Scan full diameter of the sample without stitching
- Video: 5MP high-resolution color camera
- Arc correction: Removes error due to arc motion of the stylus
- Software: Easy-to-use software interface
- Production capability: Fully automated with sequencing, pattern recognition and SECS/GEM
- 晶圆处理程序：自动加载75mm至200mm不透明（例如硅）和透明（例如蓝宝石）样品
Applications
- 台阶高度：2D和3D步骤高度
- Texture: 2D and 3D roughness and waviness
- Form: 2D and 3D bow and shape
- Stress: 2D and 3D thin film stress
- Defect review: 2D and 3D defect surface topography
Industries
- 半导体
- Compound semiconductor
- LED：发光二极管
- MEMS: Micro-electro-mechanical systems
- Data storage
- Automotive
- And more: Contact us with your requirements
